Difference between revisions of "Nano 3G"
Nano 3G
| Line 16: | Line 16: | ||
| 3 | | 3 | ||
| [http://www.samsung.com/global/system/business/semiconductor/product/2007/11/13/236652ds_k4x56163pi.pdf K4X56163PI] or Qimonda HYE18M169CX75 | | [http://www.samsung.com/global/system/business/semiconductor/product/2007/11/13/236652ds_k4x56163pi.pdf K4X56163PI] or Qimonda HYE18M169CX75 | ||
| − | | | + | |0728 |
| + | C | ||
| + | HYE18M256 | ||
| + | 169CX75 | ||
| + | W3338092 | ||
| WORK ON THIS: Like the flash chip, the memory also varies. The most popular chip seems to be the [http://www.samsung.com/global/system/business/semiconductor/product/2007/11/13/236652ds_k4x56163pi.pdf K4X56163PI]. Another similar one that is sometimes used is the Qimonda HYE18M169CX75 | | WORK ON THIS: Like the flash chip, the memory also varies. The most popular chip seems to be the [http://www.samsung.com/global/system/business/semiconductor/product/2007/11/13/236652ds_k4x56163pi.pdf K4X56163PI]. Another similar one that is sometimes used is the Qimonda HYE18M169CX75 | ||
|- | |- | ||
| Line 37: | Line 41: | ||
| 1 | | 1 | ||
| WM1870 | | WM1870 | ||
| − | | | + | |APPLE |
| + | 338S0462 | ||
| + | 76BZKTM | ||
| | | | ||
|- | |- | ||
Revision as of 22:14, 30 July 2010
Components
| Component | Label | Part | Markings | Notes |
|---|---|---|---|---|
| CPU | 2 | Samsung S5L8702 | 337S3473 8702
NONBWOEC 0731 ARM |
ARM926EJ-S processor. The package itself is Apple-branded and marked 337S3473 8702. |
| SDRAM | 3 | K4X56163PI or Qimonda HYE18M169CX75 | 0728
C HYE18M256 169CX75 W3338092 |
WORK ON THIS: Like the flash chip, the memory also varies. The most popular chip seems to be the K4X56163PI. Another similar one that is sometimes used is the Qimonda HYE18M169CX75 |
| Utility Flash | 5 | SST25VF080B | Like the other SST chips, this one is also extremely well documented. | |
| NAND Flash | 6 | Varies | Samsung 728
K9HCG08U5M PCB0 FCF285X1 |
|
| Audio codec | 1 | WM1870 | APPLE
338S0462 76BZKTM |
|
| Power manager | 4 | D1671B |
Helpful pages
Chip analyses:
Teardowns:

