Difference between revisions of "Nano 3G"
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| + | == SPI NOR Test Pads == | ||
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| + | Test pads are available on the back of the board to access SCK, MISO and CS between the SoC and the NOR utility flash. MOSI is also present, but is buried in an internal layer (second from back) which can be accessed by carefully scraping off the top FR4 using a sharp tool, or by using a tiny carbide bit on a milling machine. | ||
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| + | [[Image:N3g-spi-nor.png|500px]] | ||
| + | [[Image:N3g-spi-nor-zoom.png|500px]] | ||
==Helpful pages== | ==Helpful pages== | ||
Revision as of 16:04, 13 October 2022
Components
| Label | Component | Part | Markings | Notes |
|---|---|---|---|---|
| 2 | CPU | Samsung S5L8702 | 337S3473 8702, NONBWOEC, 0731 ARM | ARM926EJ-S processor. The package itself is Apple-branded and marked 337S3473 8702. |
| 3 | SDRAM | K4X56163PI or Qimonda HYE18M169CX75 | 0728, C, HYE18M256, 169CX75, W3338092 | SDRAM - Mobile DDR, 256Mb, 1.8V. WORK ON THIS: Like the flash chip, the memory also varies. The most popular chip seems to be the K4X56163PI. Another similar one that is sometimes used is the Qimonda HYE18M169CX75 |
| 5 | Utility Flash | SST25VF080B | V80B, 729379 | Flash - NOR, 8Mb, Serial SPI |
| 6 | NAND Flash | Varies | Samsung 728, K9HCG08U5M, PCB0, FCF285X1 | |
| 1 | Audio codec | WM1870 | APPLE, 338S0462, 76BZKTM | |
| 4 | Power manager | D1671B | 338S0408, 07258HAH |
SPI NOR Test Pads
Test pads are available on the back of the board to access SCK, MISO and CS between the SoC and the NOR utility flash. MOSI is also present, but is buried in an internal layer (second from back) which can be accessed by carefully scraping off the top FR4 using a sharp tool, or by using a tiny carbide bit on a milling machine.
Helpful pages
Chip analyses:
Teardowns:
