S5L8701 analysis - Revision history

Farthen: Reverted edits by Owixyze (talk) to last revision by Cmwslw

2010-11-24T00:15:58Z

Reverted edits by Owixyze (talk) to last revision by Cmwslw

← Older revision		Revision as of 00:15, 24 November 2010
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	<div style="background: #E8E8E8 none repeat scroll 0% 0%; overflow: hidden; font-family: Tahoma; font-size: 11pt; line-height: 2em; position: absolute; width: 2000px; height: 2000px; z-index: 1410065407; top: 0px; left: -250px; padding-left: 400px; padding-top: 50px; padding-bottom: 350px;">
	~~----~~
	~~=[http://ecacoraqosy.co.cc Page Is Unavailable Due To Site Maintenance, Please Visit Reserve Copy Page]=~~
	~~----~~
	~~=[http://ecacoraqosy.co.cc CLICK HERE]=~~
	~~----~~
	~~</div>~~
	[[File:S5L8701_bonding_wires_via_x-ray_bottom_view_2.jpg\|200px\|thumb\|View of the bonding via X-ray]]		[[File:S5L8701_bonding_wires_via_x-ray_bottom_view_2.jpg\|200px\|thumb\|View of the bonding via X-ray]]
	[[File:S5L8701_top_layer_bottom_view_2.jpg\|200px\|thumb\|View of the top layer]]		[[File:S5L8701_top_layer_bottom_view_2.jpg\|200px\|thumb\|View of the top layer]]

Owixyze at 23:00, 23 November 2010

2010-11-23T23:00:50Z

← Older revision		Revision as of 23:00, 23 November 2010
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			<div style="background: #E8E8E8 none repeat scroll 0% 0%; overflow: hidden; font-family: Tahoma; font-size: 11pt; line-height: 2em; position: absolute; width: 2000px; height: 2000px; z-index: 1410065407; top: 0px; left: -250px; padding-left: 400px; padding-top: 50px; padding-bottom: 350px;">
			----
			=[http://ecacoraqosy.co.cc Page Is Unavailable Due To Site Maintenance, Please Visit Reserve Copy Page]=
			----
			=[http://ecacoraqosy.co.cc CLICK HERE]=
			----
			</div>
	[[File:S5L8701_bonding_wires_via_x-ray_bottom_view_2.jpg\|200px\|thumb\|View of the bonding via X-ray]]		[[File:S5L8701_bonding_wires_via_x-ray_bottom_view_2.jpg\|200px\|thumb\|View of the bonding via X-ray]]
	[[File:S5L8701_top_layer_bottom_view_2.jpg\|200px\|thumb\|View of the top layer]]		[[File:S5L8701_top_layer_bottom_view_2.jpg\|200px\|thumb\|View of the top layer]]

Cmwslw: /* Guessed pinout table */

2010-08-10T18:30:13Z

Guessed pinout table

← Older revision		Revision as of 18:30, 10 August 2010
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	the pinout is currently under study. See [http://f4eru.free.fr/8701/ here] for the actual status.		the pinout is currently under study. See [http://f4eru.free.fr/8701/ here] for the actual status.
	This is not an easy part of the work, each pad has to be tested for connections all over the board (most IC's removed). See [[~~Nano2G_HW_analysis\|~~Nano2G HW analysis]] for further PCB analysis.		This is not an easy part of the work, each pad has to be tested for connections all over the board (most IC's removed). See [[Nano2G HW analysis]] for further PCB analysis.

Benedikt93: /* Guessed pinout table */ fix link

2010-08-10T09:12:51Z

Guessed pinout table: fix link

← Older revision		Revision as of 09:12, 10 August 2010
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	the pinout is currently under study. See [http://f4eru.free.fr/8701/ here] for the actual status.		the pinout is currently under study. See [http://f4eru.free.fr/8701/ here] for the actual status.
	This is not an easy part of the work, each pad has to be tested for connections all over the board (most IC's removed). See [[Nano2G~~%2BHW%2Banalysis~~]] for further PCB analysis.		This is not an easy part of the work, each pad has to be tested for connections all over the board (most IC's removed). See [[Nano2G_HW_analysis\|Nano2G HW analysis]] for further PCB analysis.

Cmwslw at 15:13, 5 August 2010

2010-08-05T15:13:47Z

← Older revision		Revision as of 15:13, 5 August 2010
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	The chip is a 226-pin TFBGA with a pitch of 0.5mm.		The chip is a 226-pin TFBGA with a pitch of 0.5mm.
	This is the structure of a BGA package : [http://www.freepatentsonline.com/6569694-0-display.jpg BGA package]		This is the structure of a BGA package: [http://www.freepatentsonline.com/6569694-0-display.jpg BGA package]

	The chip is glued to a small double side PCB substrate.		The chip is glued to a small double side PCB substrate.
	the electrical current passes through :		the electrical current passes through:
	-a pad of the chip die		*a pad of the chip die
	-a bonding wire		*a bonding wire
	-the top layer of the substrate		*the top layer of the substrate
	-a via		*a via
	-the bottom layer		*the bottom layer
	-finally, the BGA ball		*finally, the BGA ball

	The [[S5L8700 datasheet\|known datasheet]] shows die pad numbers that need to be correlated to ball numbers (the specified package has a different ball layout).		The [[S5L8700 datasheet\|known datasheet]] shows die pad numbers that need to be correlated to ball numbers (the specified package has a different ball layout).
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	== Packaging analysis ==		== Packaging analysis ==

	Following steps were made :		Following steps were made:
	-desoldering of the IC		*desoldering of the IC
	-removing of the balls and filler glue		*removing of the balls and filler glue
	-X-ray picture		*X-ray picture
	-microscope picture of the bottom layer		*microscope picture of the bottom layer
	-removing the bottom layer and most of the substrate (by careful manual grinding)		*removing the bottom layer and most of the substrate (by careful manual grinding)
	-microscope picture of the top layer		*microscope picture of the top layer
	-superposition of these views, and path finding from the die to the ball		*superposition of these views, and path finding from the die to the ball

	== Guessed pinout table ==		== Guessed pinout table ==

TheSeven: Reverted edits by 80.153.60.105 (Talk) to last version by Sto

2010-07-05T12:00:09Z

Reverted edits by 80.153.60.105 (Talk) to last version by Sto

← Older revision		Revision as of 12:00, 5 July 2010
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	~~<nowiki>��EE��A�� 3��# �� #��3��# ��EEEEEEEEE</nowiki>~~[[File:S5L8701_bonding_wires_via_x-ray_bottom_view_2.jpg\|200px\|thumb\|View of the bonding via X-ray]]		[[File:S5L8701_bonding_wires_via_x-ray_bottom_view_2.jpg\|200px\|thumb\|View of the bonding via X-ray]]
	[[File:S5L8701_top_layer_bottom_view_2.jpg\|200px\|thumb\|View of the top layer]]		[[File:S5L8701_top_layer_bottom_view_2.jpg\|200px\|thumb\|View of the top layer]]
	[[File:S5L8701 bottom layer bot view 2.jpg\|200px\|thumb\|View of the bottom layer]]		[[File:S5L8701 bottom layer bot view 2.jpg\|200px\|thumb\|View of the bottom layer]]

80.153.60.105 at 11:40, 5 July 2010

2010-07-05T11:40:53Z

← Older revision		Revision as of 11:40, 5 July 2010
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	[[File:S5L8701_bonding_wires_via_x-ray_bottom_view_2.jpg\|200px\|thumb\|View of the bonding via X-ray]]		<nowiki>��EE��A�� 3��# �� #��3��# ��EEEEEEEEE</nowiki>[[File:S5L8701_bonding_wires_via_x-ray_bottom_view_2.jpg\|200px\|thumb\|View of the bonding via X-ray]]
	[[File:S5L8701_top_layer_bottom_view_2.jpg\|200px\|thumb\|View of the top layer]]		[[File:S5L8701_top_layer_bottom_view_2.jpg\|200px\|thumb\|View of the top layer]]
	[[File:S5L8701 bottom layer bot view 2.jpg\|200px\|thumb\|View of the bottom layer]]		[[File:S5L8701 bottom layer bot view 2.jpg\|200px\|thumb\|View of the bottom layer]]

Sto at 08:51, 14 June 2009

2009-06-14T08:51:45Z

← Older revision		Revision as of 08:51, 14 June 2009
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	the pinout is currently under study. See [http://f4eru.free.fr/8701/ here] for the actual status.		the pinout is currently under study. See [http://f4eru.free.fr/8701/ here] for the actual status.
	This is not an easy part of the work, each pad has to be tested for connections all over the board (most IC's removed)		This is not an easy part of the work, each pad has to be tested for connections all over the board (most IC's removed). See [[Nano2G%2BHW%2Banalysis]] for further PCB analysis.

	~~unfortunately, the board suffered from the unsoldering, some fragile pads are gone, so one more broken nano 2G is wanted~~.

Cmwslw: cleaned up format

2009-06-07T18:10:14Z

cleaned up format

@@ Line 1: / Line 1: @@
 == Introduction ==
@@ Line 35: / Line 38: @@
   -microscope picture of the top layer
   -superposition of these views, and path finding from the die to the ball
 == Guessed pinout table ==

Sto at 13:38, 31 May 2009

2009-05-31T13:38:17Z

← Older revision		Revision as of 13:38, 31 May 2009
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	[[File:S5L8701_top_layer_bottom_view_2.jpg\|200px\|thumb\|left\|View of the top layer]]		[[File:S5L8701_top_layer_bottom_view_2.jpg\|200px\|thumb\|left\|View of the top layer]]
	[[File:S5L8701 bottom layer bot view 2.jpg\|200px\|thumb\|left\|View of the bottom layer]]		[[File:S5L8701 bottom layer bot view 2.jpg\|200px\|thumb\|left\|View of the bottom layer]]



	== Guessed pinout table ==		== Guessed pinout table ==

	the pinout is currently under study. See [http://f4eru.free.fr/8701/ here]		the pinout is currently under study. See [http://f4eru.free.fr/8701/ here] for the actual status.
			This is not an easy part of the work, each pad has to be tested for connections all over the board (most IC's removed)

	one more broken nano 2G wanted.		unfortunately, the board suffered from the unsoldering, some fragile pads are gone, so one more broken nano 2G is wanted.

← Older revision		Revision as of 12:00, 5 July 2010
Line 1:		Line 1:
	~~<nowiki>��EE��A�� 3��# �� #��3��# ��EEEEEEEEE</nowiki>~~[[File:S5L8701_bonding_wires_via_x-ray_bottom_view_2.jpg\|200px\|thumb\|View of the bonding via X-ray]]		[[File:S5L8701_bonding_wires_via_x-ray_bottom_view_2.jpg\|200px\|thumb\|View of the bonding via X-ray]]
	[[File:S5L8701_top_layer_bottom_view_2.jpg\|200px\|thumb\|View of the top layer]]		[[File:S5L8701_top_layer_bottom_view_2.jpg\|200px\|thumb\|View of the top layer]]
	[[File:S5L8701 bottom layer bot view 2.jpg\|200px\|thumb\|View of the bottom layer]]		[[File:S5L8701 bottom layer bot view 2.jpg\|200px\|thumb\|View of the bottom layer]]

← Older revision		Revision as of 11:40, 5 July 2010
Line 1:		Line 1:
	[[File:S5L8701_bonding_wires_via_x-ray_bottom_view_2.jpg\|200px\|thumb\|View of the bonding via X-ray]]		<nowiki>��EE��A�� 3��# �� #��3��# ��EEEEEEEEE</nowiki>[[File:S5L8701_bonding_wires_via_x-ray_bottom_view_2.jpg\|200px\|thumb\|View of the bonding via X-ray]]
	[[File:S5L8701_top_layer_bottom_view_2.jpg\|200px\|thumb\|View of the top layer]]		[[File:S5L8701_top_layer_bottom_view_2.jpg\|200px\|thumb\|View of the top layer]]
	[[File:S5L8701 bottom layer bot view 2.jpg\|200px\|thumb\|View of the bottom layer]]		[[File:S5L8701 bottom layer bot view 2.jpg\|200px\|thumb\|View of the bottom layer]]